Singapore – Danfoss and HyprCool recently collaborated to combine their latest liquid cooling solutions into a data centre server rack, and it was displayed at the recent Data Centre World Asia exhibition.
The collaboration between Danfoss and HyprCool aims to provide an innovative value-added solution for liquid cooling to the data centre industry, helping the owners to improve their data centres’ energy efficiency, climate footprint and uptime.
The concept of liquid cooling has taken over many of the conversation within our data centre circles. The two main liquid cooling technology are cold plates and immersion systems and to a much smaller extend, rear-door heat exchangers have helped customers overcome the limitations associated with air-cooling and provided a way of addressing the growing demand for high compute density and higher heat loads.
HyprCool recently introduced the next generation of liquid cooling systems utilising their patented Spraying Jet Impingement cooling method. HyprCool’s Spraying Jet Impingement technology is a carefully crafted system that improves upon the current atomizes spray method by utilising hundreds of individual jets. This not only ensures a higher availability for cooling, but it also uses less energy to provide the coverage required for the entire server. The approach is versatile and enables the cooling system to take on the toughest cooling challenges in the tightest of space inside the server chassis.
The system requires a plumbing design to ensure proper fluid distribution for adequate cooling coverage. To achieve that, Danfoss liquid cooling coupling comes in place to deliver the highly available liquid cooling for each server.
Danfoss is a world leader in designing and producing a range of high-quality thermal management solutions used in liquid-cooled servers and supporting fluid network. Its couplings provide a high flow and low resistance, ensuring the secondary (internal coolant) loops is reliably connected to the primary (facility) water loops for efficient heat rejection.
For liquid cooling specifically, thermal efficiency and reduced space requirements enable increased chip density, unlocking the full potential of data centres. Danfoss’ efficient and compact fluid conveyance solutions route coolant from the source to the chip, keeping high-performing processors running smoothly, even during peak loads, that helps to provide consistent computing power and increased performance.
The Danfoss Hansen® FD83 Coupling Series is a full-flow dual-interlock coupling. Designed for industry standard, this stainless-steel coupling has been supporting liquid cooling reliably for decades.
In addition, the Danfoss UQD (Universal Quick Disconnect) coupling is designed for high flow rate and no spillage – providing a perfect solution for in-rack applications with smaller hose lines. The Danfoss UQD Blind Mate provides a self-alignment feature to help connection in location with limited accessibility or visibility and guarantees 100 percent helium-leak testing on every coupling.
Danfoss Royal™ EHW194 EPDM hose is engineered for durability and ease of use and features industry-leading safety ratings, superior kink resistance and long-lasting performance.
The liquid cooling server rack was displayed at the Data Centre World Asia exhibition, which took place in Marina Bay Sands Expo and Convention Centre from 9th to 10th October, 2024, and subsequently will be presented at the Danfoss Sustainability Technology Center1 and HyprCool’s office.
